Accepted Papers Will Be Collected in IEEE Xplore !
Taiwan acts as a globally pivotal position in the IC packaging, testing and PCB industry with high percentage revenues on 54.3% of IC packaging, 65.5% of testing and 26.6% of PCB industry. By the advanced development, the 3rd International Microsystems, Packaging, Assembly and Circuits Technology (IMPACT) Conference and the 10th International Conference on Electronics Materials and Packaging (EMAP) will be held as a joint conference which is in conjunction with TPCA Show at Taipei Nangang Exhibition Hall during October 22 to24, 2008. Original and unpublished papers on all aspects of Microsystems, Packaging, Assembly, Materials and PCB from worldwide will be solicited.
 
Organized by IEEE CPMT-Taipei, ITRI, IMAPS-Taiwan, ISU University, SMTA and TPCA, the 3rd IMPACT and the 10th EMAP Joint Conference and TPCA Show 2008 are expected to establish a ¡§Creative Collaboration, More Than Packaging¡¨ program to bring together scientists, engineers and experts actively engaged in research and development on Microsystems, IC Packaging, Assembly, Materials and PCB to discuss the current progress and emerging technologies in the fields.
 
Date: Wednesday-Friday, October 22--24, 2008
Venue: Taipei Nangang Exhibition Hall, Taipei, Taiwan
Conference: The 3rd IMPACT and 10th EMAP Joint Conference
Exhibition: TPCA Show 2008

 
Charles E. Bauer   TechLead Corporation, USA
Michael Pecht   The University of Maryland at College Park, USA
More speaker information will be provided soon.

IEEE COMPONENTS, PACKAGING, & MANUFACTURING TECHNOLOGY SOCIETY (IEEE CPMT-Taipei)
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE, TAIWAN (ITRI)
INTERNATIONAL MICROELECTRONICS AND PACKAING SOCIETY -TAIWAN (IMAPS-Taiwan)
I-SHOU UNIVERSITY (ISU)
I SURFACE MOUNT TECHNOLOGY ASSOCIATION (SMTA)
TAIWAN PRINTED CIRCUIT ASSOCIATION (TPCA)

For questions on paper submission, please contact:
 
Technical Program Chair
  Dr. Hsiang-Chen Hsu ®}²»ºÕ
I-SHOU University
Tel: +886 7 657 7711 #2031
Fax: +886 7 657 8853
E-Mail: tw2008@isu.edu.tw
 
Secretariat
  Mr. Long-Shien Lin ªLÀs½å
Industrial Technology Research Institute (ITRI)
Tel: +886 3 591 7127
Fax: +886 3 591 7193
E-Mail: tw2008@isu.edu.tw
 
Secretariat
  Ms.Michelle Hung ¬x¶®ªå
Taiwan Printed Circuit Association (TPCA)
Tel: +886 3 317 7272 #401
Fax: +886 3 317 9077
E-Mail: tw2008@isu.edu.tw
 
Requests for information about the Symposia should be directed to:
  Ms.Yaffy Liu ¼B²Q¬Â
Taiwan Printed Circuit Association (TPCA)
Tel: +886 3 317 7272 #402
Fax: +886 3 317 9077
E-Mail: tw2008@isu.edu.tw
  2008/5/7
  Keynote Speaker-Charles E. Bauer and Michael Pecht
  2008/5/7
  22 Invited Speakers will join IMPACT/EMAP!
  2008/5/7
  Industrial Session:NanYa PCB/Dupont/ChipMOS
  2008/4/2
  Call For Paper-Accepted papers will be collected in IEEE!!
  2008/2/27
  Call for Paper Starts!!
 
 

City Tour

Plant tour

Golf tournament

Travel Information

 
Sponsorship Description
 
 

 

           
Copyright © 2008 IMPACT IMPACT 2007 | Hotel Information