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| Accepted
Papers Will Be Collected in IEEE Xplore ! |
| Taiwan acts as a globally pivotal
position in the IC packaging, testing and
PCB industry with high percentage revenues
on 54.3% of IC packaging, 65.5% of testing
and 26.6% of PCB industry. By the advanced
development, the 3rd International Microsystems,
Packaging, Assembly and Circuits Technology
(IMPACT) Conference and the 10th International
Conference on Electronics Materials and Packaging
(EMAP) will be held as a joint conference
which is in conjunction with TPCA Show at
Taipei Nangang Exhibition Hall during October
22 to24, 2008. Original and unpublished papers
on all aspects of Microsystems, Packaging,
Assembly, Materials and PCB from worldwide
will be solicited. |
| ¡@ |
| Organized by IEEE CPMT-Taipei,
ITRI, IMAPS-Taiwan, ISU University, SMTA and
TPCA, the 3rd IMPACT and the 10th EMAP Joint
Conference and TPCA Show 2008 are expected
to establish a ¡§Creative
Collaboration, More Than Packaging¡¨
program to bring together scientists, engineers
and experts actively engaged in research and
development on Microsystems, IC Packaging,
Assembly, Materials and PCB to discuss the
current progress and emerging technologies
in the fields. |
| |
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 |
| ¡@ |
| October 22, 2008 |
| Yutake Tsukada (JIEP, Japan) 10:20AM-11:10AM |
| Topic: To be provided soon. |
| ¡@ |
Charles E. Bauer (TechLead Corporation, USA) 11:10AM-12:00AM
|
| Topic: To be provided soon. |
| ¡@ |
| October 23, 2008 |
| G.Q. Zhang (Delft University of Technology, The Netherlands.) 9:00AM-9:50AM |
| Topic: The Changing landscape of semiconductors industry |
| ¡@ |
October 24, 2008
|
| Michael Pecht (CALCE , University of Maryland, USA) 9:00-9:50 |
| Topic: A New Approach to Qualification Testing |
|
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|
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 |
 |
IEEE COMPONENTS, PACKAGING,
& MANUFACTURING TECHNOLOGY SOCIETY
(IEEE CPMT-Taipei) |
|
INDUSTRIAL TECHNOLOGY
RESEARCH INSTITUTE, TAIWAN (ITRI) |
|
INTERNATIONAL MICROELECTRONICS
AND PACKAING SOCIETY -TAIWAN (IMAPS-Taiwan) |
|
I-SHOU UNIVERSITY (ISU) |
|
I SURFACE MOUNT TECHNOLOGY
ASSOCIATION (SMTA) |
|
TAIWAN PRINTED CIRCUIT
ASSOCIATION (TPCA) |
|
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 |
| For questions
on paper submission, please contact: |
| ¡@ |
|
Technical Program
Chair |
| ¡@ |
Dr. Hsiang-Chen Hsu ®}²»ºÕ
I-SHOU University
Tel: +886 7 657 7711 #2031
Fax: +886 7 657 8853
E-Mail: tw2008@isu.edu.tw
|
| ¡@ |
|
Secretariat |
| ¡@ |
Mr. Long-Shien Lin ªLÀs½å
Industrial Technology Research Institute
(ITRI)
Tel: +886 3 591 7127
Fax: +886 3 591 7193
E-Mail: tw2008@isu.edu.tw
|
| ¡@ |
|
Secretariat |
| ¡@ |
Ms.Michelle Hung ¬x¶®ªå
Taiwan Printed Circuit Association (TPCA)
Tel: +886 3 317 7272 #401
Fax: +886 3 317 9077
E-Mail: tw2008@isu.edu.tw |
| ¡@ |
| Requests for
information about the Symposia should
be directed to: |
| ¡@ |
| ¡@ |
Ms.Yaffy Liu ¼B²Q¬Â
Taiwan Printed Circuit Association (TPCA)
Tel: +886 3 317 7272 #402
Fax: +886 3 317 9077
E-Mail: tw2008@isu.edu.tw |
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2008/8/13
